Over 1,500 Participants and 50 International Delegates Attend IIP’s ISPI 2026 to Discuss AI and Sustainable Packaging
New Delhi, March 13, 2026
Union Minister for Commerce and Industry Piyush Goyal virtually launched the Bharat Packaging Exhibition 2027 during the second day of the 6th International Summit for Packaging Industry (ISPI 2026) being organised by the Indian Institute of Packaging (IIP) in New Delhi.
The summit, being held under the theme “Packaging 5S-AI – Safe, Secure, Standardised, Smart, Sustainable and Artificial Intelligence,” continued its second day with participation from industry leaders, experts, researchers and international delegates.
The event featured a special video message from the Union Minister, who could not attend the summit in person due to the ongoing Parliament session.
In his recorded address, Goyal extended his greetings to the participants and highlighted the growing importance of packaging in today’s global economy. He said that changing food systems, evolving consumption patterns and climate concerns are increasing the demand for safe and sustainable food, making packaging a crucial element for food security, global trade and consumer confidence. He also noted that India is emerging as a key player in the agri-food sector, particularly in exports, supported by improved cold-chain infrastructure and innovative packaging solutions that help Indian products reach premium global markets.
Emphasising the importance of global standards, Goyal said that as India expands trade through multiple Free Trade Agreements, packaging that complies with international standards will be essential for strengthening exports and ensuring product safety. He added that institutions like the Indian Institute of Packaging play an important role in supporting industries through technology guidance, innovation, testing services and training programmes.
The Union Minister also underlined the need for sustainability and digital innovation in the packaging sector. He said the industry should adopt circular economy principles such as recyclable materials and waste reduction. Linking the sector with India’s long-term vision, he stated that achieving Viksit Bharat by 2047 will depend on resilient supply chains and innovation-driven industries.
As part of his message, Goyal also announced and virtually launched the Bharat Packaging Exhibition 2027, which will be organised by the Indian Institute of Packaging in collaboration with India Expo Mart Ltd.
Commenting on the significance of the summit, Tanweer Alam, Additional Director and Regional Officer, IIP–Delhi, said that the Packaging 5S-AI framework represents a forward-looking approach for the industry by integrating safety, security and standardisation with smart technologies and artificial intelligence. He noted that such innovations will strengthen traceability, improve quality control and enhance supply chain efficiency while keeping sustainability at the centre of packaging development.
R. K. Mishra, IRS, Director, Indian Institute of Packaging, said that platforms like ISPI 2026 bring together policymakers, industry leaders, researchers and global experts to exchange knowledge and discuss developments in the packaging sector. He added that the institute continues to support industries through research, testing services, training and technology initiatives aimed at strengthening India’s packaging ecosystem and enabling products to reach global markets safely and efficiently.
The second day of the summit also featured technical sessions on topics such as AI-enabled packaging systems, sustainable packaging materials, smart technologies for product traceability and quality control, and strategies to align packaging practices with export requirements. These discussions built on the first day’s deliberations and explored how the Packaging 5S-AI framework can improve supply chain efficiency, reduce wastage and support initiatives such as One District One Product (ODOP) and cluster-based development.
With more than 1,500 participants, including nearly 50 international delegates, ISPI 2026 continues to serve as a platform for knowledge sharing, technology exchange and capacity building in the packaging sector.
The three-day summit will conclude on March 14, 2026, with further sessions focusing on collaboration between government and industry to strengthen packaging systems and support global trade.
